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ISO 9001 certified |
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Quality management according to: ISO 9001:2008
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Tantalkondensatoren
| 111 |
|
6,3-100 V |
0,1-330 uF |
-55 °C |
125 °C |
Hermetically sealed metal case, Excellent stability and high reliability |
| 112 |
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6,3-50 V |
1,5-1000 uF |
-55 °C |
125 °C |
Hermetically sealed metal case, Extended capacitance |
| 204 |
|
3,15-50 V |
0,1-470 uF |
-55 °C |
125 °C |
Epoxy coating, High reliability |
| 242 |
|
6,3-50 V |
0,1-47 uF |
-55 °C |
125 °C |
Silicone molding, High-frequency noise by-passing |
| 251 |
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2-35 V |
1-220 uF |
-55 °C |
125 °C |
Epoxy molding chip
Ultra Miniature Size with Higher Capacitance, Face-down terminals |
| 267E |
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2,5-50 V |
0,22-220 uF |
-55 °C |
125 °C |
Epoxy molding chip
Extended Series |
| 267M |
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2-50 V |
0,047-220 uF |
-55 °C |
85 °C |
Epoxy molding chip
Standard Series |
| 267N |
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2-35 V |
0,1-100 uF |
-55 °C |
125 °C |
Epoxy molding chip
High Reliability Series |
| 267P |
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2-50 V |
0,1-100 uF |
-55 °C |
125 °C |
Epoxy molding chip
For Aero-space |
| 269 |
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6,3-50 V |
0,15-100 uF |
-55 °C |
125 °C |
Epoxy molding chip
Built-in fuse |
| 271 |
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2-35 V |
0,1-68 uF |
-55 °C |
150 °C |
Epoxy molding chip
High reliability, Withstanding High Temperature |
| 277 |
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2-20 V |
0,1-15 uF |
-55 °C |
125 °C |
Epoxy molding chip, Low Profile 1,2mm max. |
| 278M |
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2,5-20 V |
0,047-22 uF |
-55 °C |
125 °C |
Epoxy molding chip
Ultra miniature size |
| 281 |
|
2-35 V |
4,7-330 uF |
-55 °C |
125 °C |
Epoxy molding chip
Ultra Low ESR |
| TCA |
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2,5-10 V |
22-330 uF |
-55 °C |
105 °C |
Epoxy molding chip, Tantalum solid electrolyte capacitors with conductive polymer |
| TCB |
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2,5-10 V |
4,7-15 uF |
-55 °C |
105 °C |
Epoxy molding chip
Face-down terminals, Tantalum solid electrolyte capacitors with conductive polymer |
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