Tantalkondensatoren

Name	Rated Voltage	Capacitance	Min. Top	Max. Top	Produktbeschreibung
111	6,3-100 V	0,1-330 uF	-55 °C	125 °C	Hermetically sealed metal case, Excellent stability and high reliability
112	6,3-50 V	1,5-1000 uF	-55 °C	125 °C	Hermetically sealed metal case, Extended capacitance
204	3,15-50 V	0,1-470 uF	-55 °C	125 °C	Epoxy coating, High reliability
242	6,3-50 V	0,1-47 uF	-55 °C	125 °C	Silicone molding, High-frequency noise by-passing
251	2-35 V	1-220 uF	-55 °C	125 °C	Epoxy molding chip Ultra Miniature Size with Higher Capacitance, Face-down terminals
267E	2,5-50 V	0,22-220 uF	-55 °C	125 °C	Epoxy molding chip Extended Series
267M	2-50 V	0,047-220 uF	-55 °C	85 °C	Epoxy molding chip Standard Series
267N	2-35 V	0,1-100 uF	-55 °C	125 °C	Epoxy molding chip High Reliability Series
267P	2-50 V	0,1-100 uF	-55 °C	125 °C	Epoxy molding chip For Aero-space
269	6,3-50 V	0,15-100 uF	-55 °C	125 °C	Epoxy molding chip Built-in fuse
271	2-35 V	0,1-68 uF	-55 °C	150 °C	Epoxy molding chip High reliability, Withstanding High Temperature
277	2-20 V	0,1-15 uF	-55 °C	125 °C	Epoxy molding chip, Low Profile 1,2mm max.
278M	2,5-20 V	0,047-22 uF	-55 °C	125 °C	Epoxy molding chip Ultra miniature size
281	2-35 V	4,7-330 uF	-55 °C	125 °C	Epoxy molding chip Ultra Low ESR
TCA	2,5-10 V	22-330 uF	-55 °C	105 °C	Epoxy molding chip, Tantalum solid electrolyte capacitors with conductive polymer
TCB	2,5-10 V	4,7-15 uF	-55 °C	105 °C	Epoxy molding chip Face-down terminals, Tantalum solid electrolyte capacitors with conductive polymer